Lee College District Purchasing Dept. Sealed Solicitation

Title: Credit Card Processing and Online Payment Services RFP 210414-02

Deadline: 4/14/2021 10:00 AM   (UTC-06:00) Central Time (US & Canada)

Status: Awarded

Solicitation Number: RFP 210414-02

Description:

The Lee College District is requesting sealed proposals for Credit Card Processing and Online Payment Services.  All proposals must be uploaded to Vendor Registry by the due date and time of Wednesday, April 14, 2021, at 10:00 AM. The deadline for questions is Friday, April 9, at 12:00 PM. Questions regarding this solicitation must be submitted via Vendor Registry accessed from the Lee College Purchasing webpage. For questions related to using Vendor Registry, use the help option/chat for assistance. If you need further assistance please contact lcsolicitations@lee.edu. Emailed or hardcopy proposals will not be accepted and will be disqualified and/or returned unopened. Vendors will receive confirmation from Vendor Registry when their proposal is successfully received. Late proposals will not be considered and will be returned to the vendor unopened. A confirmation of receipt for your submittal will be sent to the email address provided on the outside envelope.


Documents:

Documents as of 3/26/2021
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Addition 1

Posted: 4/9/2021

Type of Addition: Addendum No1. RFP 210414-02 Credit Card Processing and Online Payment Services

Overview: Please see attachment; Addendum No.1 Credit Card Processing and Online Payment Services RFP 210414-12

Documents:

Addition 2

Posted: 4/13/2021

Type of Addition: Addendum No. 2

Overview: WebEx Opening

Pre-Bid Meeting Details: Please see attachment for WebEx opening information and registration.

Documents:

Addition 3

Posted: 4/13/2021

Type of Addition: Addendum No. 2 WebEx Opening Credit Card Processing and Online Payment Services RFP 210414-02

Overview: Please see attachment for WebEx information and registration, for the opening of the bid documents.

Addition 4

Posted: 8/3/2021

Type of Addition: Award Information

Overview: Awarded to Touchnet Information Systems May 20, 2021

Question 1

Posted: 3/31/2021

Question: Will the College accept electronic signatures, including those entered via DocuSign?

Response: We have already responded to this question. Please see the public solicitation.

Question 2

Posted: 4/2/2021

Question: 1. What are the driving forces or primary goals for improvement that would prompt the College to make a decision to re-platform now? 2. How many transactions, per year, do students make through your current e-payment portal? Of those, how many are credit card or ACH? 3. How many students enroll in payment plans each year? 4. Does Lee College plan to use current MIDS, or would you consider using ours?

Response: We have already responded to this question. Please see the public solicitation.

Question 3

Posted: 4/2/2021

Question: Regarding payment plans referenced in section 5 (Payment Plan Management System), is the College looking for the vendor to provide full-service management of the payment plans on behalf of the college? Alternatively, is the college looking for the vendor to provide a software solution for payment plans so the college can offer their own internally-managed payment plans through the selected vendor software?

Response: We have already responded to this question. Please see the public solicitation.

Posted: 4/9/2021

Type of Addition: Addendum No1. RFP 210414-02 Credit Card Processing and Online Payment Services

Overview: Please see attachment; Addendum No.1 Credit Card Processing and Online Payment Services RFP 210414-12

Documents:

Posted: 4/13/2021

Type of Addition: Addendum No. 2

Overview: WebEx Opening

Pre-Bid Meeting Details: Please see attachment for WebEx opening information and registration.

Documents:

Posted: 4/13/2021

Type of Addition: Addendum No. 2 WebEx Opening Credit Card Processing and Online Payment Services RFP 210414-02

Overview: Please see attachment for WebEx information and registration, for the opening of the bid documents.

Posted: 8/3/2021

Type of Addition: Award Information

Overview: Awarded to Touchnet Information Systems May 20, 2021

Posted: 3/31/2021

Question: Will the College accept electronic signatures, including those entered via DocuSign?

Response: We have already responded to this question. Please see the public solicitation.

Posted: 4/2/2021

Question: 1. What are the driving forces or primary goals for improvement that would prompt the College to make a decision to re-platform now? 2. How many transactions, per year, do students make through your current e-payment portal? Of those, how many are credit card or ACH? 3. How many students enroll in payment plans each year? 4. Does Lee College plan to use current MIDS, or would you consider using ours?

Response: We have already responded to this question. Please see the public solicitation.

Posted: 4/2/2021

Question: Regarding payment plans referenced in section 5 (Payment Plan Management System), is the College looking for the vendor to provide full-service management of the payment plans on behalf of the college? Alternatively, is the college looking for the vendor to provide a software solution for payment plans so the college can offer their own internally-managed payment plans through the selected vendor software?

Response: We have already responded to this question. Please see the public solicitation.