University of Alabama in Huntsville Sealed Solicitation

Title: 3D Profilometer

Deadline: 6/28/2019 1:30 PM   (UTC-06:00) Central Time (US & Canada)

Status: Awarded

Solicitation Number: B002623

Description:

NOTIFICATION REQUEST FOR FORMAL PROPOSAL

Proposal Number: B002623

RESPONSE DUE BY:   06/28/19  1:30 PM

3D Profilometer B002623

 

THE UNIVERSITY OF ALABAMA IN HUNTSVILLE REQUESTS PROPOSAL FOR ITEMS/SERVICES AS PER THE POSTED SPECIFICATIONS ATTACHED FROM THE PROCUREMENT SERVICES below.

 

To register go to WEBSITE: http://www.uah.edu/business-services/vendors/bid-opportunities Vendor Registration

 

The vendor bid opening day will be June 28th at 1:30pm. I will need an automated bid loaded to UAH Vendor Registry. 

 


Documents:

Documents as of 6/18/2019
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Addition 1

Posted: 7/3/2019

Type of Addition: Edibon is the apparent lowest responsible bidder.

Overview: The bid is awarded total low to Edibon as the apparent lowest responsible bidder, meeting specifications.

Amount: $68,869.00

Documents:

Addition 2

Posted: 3/26/2020

Type of Addition: Awarded to Edibon

Overview: The bid is awarded total low to Edibon as the apparent lowest responsible bidder, meeting specifications.

Documents:

Addition 3

Posted: 3/26/2020

Type of Addition: Awarded to AFP Technology, Inc.

Overview: The bid is awarded total low to AFP Technology, Inc. as the apparent lowest responsible bidder, meeting specifications. This the correct information

Documents:

Posted: 7/3/2019

Type of Addition: Edibon is the apparent lowest responsible bidder.

Overview: The bid is awarded total low to Edibon as the apparent lowest responsible bidder, meeting specifications.

Amount: $68,869.00

Documents:

Posted: 3/26/2020

Type of Addition: Awarded to Edibon

Overview: The bid is awarded total low to Edibon as the apparent lowest responsible bidder, meeting specifications.

Documents:

Posted: 3/26/2020

Type of Addition: Awarded to AFP Technology, Inc.

Overview: The bid is awarded total low to AFP Technology, Inc. as the apparent lowest responsible bidder, meeting specifications. This the correct information

Documents: